VINcoNPC X12 featuring Mitsubishi 1200 V gen 7 chips for 1500 V DC-link applications up to 1 MW

Housed in a low-inductive package, this neutral-point clamped module’s superior design comes with many benefits: Connections are optimized for three-level topologies simplifying the busbar design. The symmetrical layout serves to share current uniformly and distribute temperature evenly to extend component life. The outstanding power density and efficiency enables more compact designs.
Read more about VINcoNPC X12.
Samples may be sourced on demand from our usual channels.

Up to 1 MW at 99 % efficiency without paralleling modules
Enhances three-level topologies’ benefits and reduces design effort
Fully symmetrical layouts for better current distribution and higher reliability
Now available with phase-change thermal interface material
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Availability
Vincotech Power Modules Inquiry:
https://www.eigbt.com/Vincotech.html
Contact: Vicky
Phone: 86-13410359515
E-mail: [email protected]
Add: D1,6th Floor,Tower 13,Lehui Center,Jihua Roard 489, Longgang District, Shenzhen, China